Semiconductor news with a technical lens: fabs, funding, roadmaps and the supply chain — with European coverage in focus.
The new EPIC Center brings chipmakers, equipment partners and researchers together to shorten the path from process research to manufacturing.
The announced collaboration focuses on applying private AI systems to semiconductor design, process engineering and manufacturing workflows.
The planned Indiana site is intended to package and test HBM made from wafers produced in Korea, with commercial production targeted for 2029.
The company announced a government-supported plan to expand 300 mm silicon photonics, silicon germanium and advanced optical packaging capacity in Japan.
A 10-year agreement sets a framework for TSMC to procure advanced packaging and test services from Amkor in Arizona.
